The thermal conductive Pad is one of the heat transfer interface materials, and has excellent thermal conductivity, good insulation, excellent fire resistance, good cushioning, controllable self-adhesiveness, thickness selectivity, and color. Tonality, ease of construction, and stability of quality have become a highly conductive medium in the production of modern electronic products..

The thermal conductive silicone pad plays a good role in linking the air distance between the heating element and the heat sink. It has good thermal conductivity and high level of withstand voltage. Its function is to fill the heating element and the heat sink, especially high performance. Components operate at high speeds and generate a significant amount of heat that must be removed immediately to ensure that the components operate at peak efficiency at normal operating temperatures.
      It has been widely used in many high-end electronic products, such as: high-power LED lamps, automotive electronic modules, power modules, calculator applications (CPU, GPU, USICS, drives), solar industry, backlight industry and so on.

Here are five steps to give you an example of the installation steps of the thermal silica film:
      1. Keep the electronic components and the thermal conductive silicone sheet clean and clean, avoiding the contamination of the surface of the electronic components. Any stain on the contact surface will cause the self-adhesiveness and thermal conductivity of the thermal conductive silicone sheet to deteriorate.
      2. When taking the thermal silica pad the large-area heat-conducting silica gel sheet should be grabbed from the center. The smaller-area sheet is not required to be grabbed, because the large-sized thermal silica sheet is unevenly stressed, which will cause deformation and affect. Subsequent operations can even damage the silicone sheet. Industry and so on.

 3. Hold the thermal silica gel on your left hand and tear off one of the protective films on your right hand. Remember not to peel off the protective film on both sides at the same time, to minimize the number and area of direct contact with the thermal conductive silicone sheet, and to maintain the self-adhesiveness and thermal conductivity of the thermal conductive silicone pad from damage.
  4. Remove the side of the protective paper, first align the heat sink toward the electronic components to be pasted, and carefully remove the heat-dissipating silicone pad, taking care to avoid the generation of air bubbles.
  5. If air bubbles are generated during operation, you can pull up the thermal pad and repeat the above steps, or use a hard plastic sheet to gently wipe off the air bubbles. The force should not be too large to avoid damage to the thermal silica film.

Tips: our company offer different thermal pad with different conductivity ,color and custom made to meet all your requirement 

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